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Product Overview
ADP16F03
The ADP16F03 series products adopt an enhanced Harvard architecture DSP core, with a main frequency of up to 150MHz, 32KW Flash, 4KW SARAM, 544W DARAM, integrated operation accelerator, operational amplifier, comparator, 12BitADC, temperature sensor, PWM controller, and SCI/SPI communication peripherals; Support 4-wire fast program burning; Support multiple square wave and chord wave motor driving modes;
Datasheet →industry Automotive Standard
Product Features
● Supply voltage
-3.3~5V (core 1.2V, analog 3V, generated by internal LDO)
● High performance 16 bit fixed-point DSP core
- maximum frequency of 150MHz
- Harvard bus structure
- fast interrupt response and processing
} ● on-chip memory Resources
-4K x 16 bit SARAM
- (256+256+32) x 16 bit DARAM
-32K x 16 bit Flash
● Operation acceleration unit
- Division, square root
- arctangent
- Parker transform
-32-bit multiply add and shift
● 30 universal I/O pins
● Event manager EM1
-4 16 bit timing/counters
-8 PWM outputs (PWM1-6 form 3 complementary groups, PWM7/8 independent)
-1 set of orthogonal encoding units
-3 capture units (CAP1/2/3)
- configurable PWM cycle interrupt generation and ADC sampling trigger timing
● ADC
-12 bits, conversion rate 1MSPS
-16 channels, including one temperature sensor channel
- Channel sorter, can set ADC sampling channel sequence
● Operational amplifier
-1 OP, can be used for bus current detection amplification
-3 PGA, can be used for phase current detection amplification
● Voltage comparator
-3 A voltage comparator with a shared reference terminal can be used for BEMF comparison detection
-2 voltage comparators, which can form upper and lower limit value protection circuits. The limit value can be configured through a pair of DAC configurations connected to the input terminals of the comparator
● interrupts
-2 external interrupts,
-29 peripheral interrupts set by PIE
● Digital delay filtering
● Clock
-10M on-chip oscillator
- PLL multiplication factor 1x~10x
● Supports WDT
● Supports 4-wire fast program burning
● Supports JTAG Online simulation
- Analysis and breakpoint function
- Hardware based real-time debugging
● ESD level (HBM): 2000V
● MSL humidity sensitivity level: 3
● Packaging form
- LQFP48 packaging
} - QFN48 package
- LQFP32 package
- QFN32 package
-3.3~5V (core 1.2V, analog 3V, generated by internal LDO)
● High performance 16 bit fixed-point DSP core
- maximum frequency of 150MHz
- Harvard bus structure
- fast interrupt response and processing
} ● on-chip memory Resources
-4K x 16 bit SARAM
- (256+256+32) x 16 bit DARAM
-32K x 16 bit Flash
● Operation acceleration unit
- Division, square root
- arctangent
- Parker transform
-32-bit multiply add and shift
● 30 universal I/O pins
● Event manager EM1
-4 16 bit timing/counters
-8 PWM outputs (PWM1-6 form 3 complementary groups, PWM7/8 independent)
-1 set of orthogonal encoding units
-3 capture units (CAP1/2/3)
- configurable PWM cycle interrupt generation and ADC sampling trigger timing
● ADC
-12 bits, conversion rate 1MSPS
-16 channels, including one temperature sensor channel
- Channel sorter, can set ADC sampling channel sequence
● Operational amplifier
-1 OP, can be used for bus current detection amplification
-3 PGA, can be used for phase current detection amplification
● Voltage comparator
-3 A voltage comparator with a shared reference terminal can be used for BEMF comparison detection
-2 voltage comparators, which can form upper and lower limit value protection circuits. The limit value can be configured through a pair of DAC configurations connected to the input terminals of the comparator
● interrupts
-2 external interrupts,
-29 peripheral interrupts set by PIE
● Digital delay filtering
-3 independently configurable delay filtering units, corresponding to external interrupts, power protection, and CAP1/2/3
● Serial communication peripherals
- SPI SCI● Clock
-10M on-chip oscillator
- PLL multiplication factor 1x~10x
● Supports WDT
● Supports 4-wire fast program burning
● Supports JTAG Online simulation
- Analysis and breakpoint function
- Hardware based real-time debugging
● ESD level (HBM): 2000V
● MSL humidity sensitivity level: 3
● Packaging form
- LQFP48 packaging
} - QFN48 package
- LQFP32 package
- QFN32 package
