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The National Third Generation Semiconductor Technology Innovation Center (Hunan) has landed in Changsha High tech Zone
On the morning of November 19, the National Third-Generation Semiconductor Technology Innovation Center (Hunan), organized by the Provincial Department of Science and Technology and led by the 48th Research Institute of China Electronics Technology Corporation, was unveiled in Changsha.
▲ On November 19, the National Third-Generation Semiconductor Technology Innovation Center (Hunan) was unveiled in Changsha
Chen Fei, Vice Governor of the People's Government of Hunan Province, attended and unveiled the plaque. Yang Jun, deputy general manager of China Electronics Technology Group Co., Ltd., delivered a video link speech. Tian Hongqi, academician of the Chinese Academy of Engineering and president of Central South University, Ling Shiming, vice president of the National University of Defense Technology, Duan Xianzhong, president of Hunan University, and Zuo Lei, chairman of China Electric Power Technology Electronic Equipment Group Co., Ltd., attended the ceremony. Zhou Yixiang, deputy secretary-general of the Hunan Provincial Government, presided over the meeting, and Lu Xianhua, deputy director of the Hunan Provincial Department of Science and Technology, delivered a speech. Vice Mayor Qiu Jixing and Director of the Management Committee of Changsha High-tech Zone Guo Lifu attended the unveiling ceremony.
The National Third-Generation Semiconductor Technology Innovation Center is coordinated by the Ministry of Science and Technology, mainly laying out and building equipment platforms in Changsha, focusing on the field of third-generation semiconductor equipment, gathering first-class talents at home and abroad, and focusing on solving the problem of "stuck neck" through industry-university-research-application cooperation, carrying out research on key technologies and basic common technologies of "forging long boards", forming a number of new technologies, new equipment, and new products, and opening up the innovation chain of "science into technology, technology into products, and products into industry".
▲ At the unveiling ceremony, the co-construction units of Guochuang Hunan Center signed a contract
It is reported that Hunan's third-generation semiconductor industry has a deep foundation and has formed a significant industrial agglomeration trend, which is one of the key layout directions of our province to build a scientific and technological innovation highland with core competitiveness. Hunan Center will form a complete equipment research and development and industrialization innovation system through the construction of domestic core equipment technology research and development and pilot testing platform, promote the application demonstration of domestic equipment, promote the continuous improvement of upstream and downstream industries such as equipment support, technical support, operation and maintenance support, and upgrade services, and radiate to form a number of first-class equipment enterprises with core innovation capabilities, support the high-quality development of the third-generation semiconductor equipment industry in our province, and enhance the competitiveness of third-generation semiconductor equipment.
