Jinxin Technology made its debut at the 2026 Shanghai International New Energy Vehicle Thermal Management Technology Exhibition and successfully concluded!

Release time：2026-06-06 Source： Clicks：98

From March 3rd to 5th, the 2026 ATC Shanghai International New Energy Vehicle Thermal Management Technology Exhibition was grandly held at the Shanghai New International Expo Center. As a benchmark exhibition in the field of thermal management for new energy vehicles in Asia, this exhibition brings together top enterprises and professional visitors from the entire industry chain, creating a top-level platform for technical exchange and business docking.

Jinxin Technology, as a leading domestic automotive grade DSP/SoC chip design enterprise , has been deeply involved in the field of automotive thermal management chips for many years. With millions of experience in mass production certification and complete domestic supply chain advantages, showcased multiple series of automotive grade chips and thermal management solutions at the exhibition. It comprehensively demonstrated the technological strength and mass production achievements of domestic chips in the field of automotive thermal management, attracting many industry colleagues to stop and exchange ideas.

The hardcore chip matrix covers the entire field of thermal management requirements

At this exhibition, Jinxin Technology showcased multiple series of automotive-grade chips, covering the full voltage level of 12V/24V/48V and adapting to the full level of thermal management control requirements. The application scenarios run through core links such as electronic water pumps/oil pumps, electronic fans, air conditioning compressors, blowers, and thermal management domain controllers.

All participating chips have passed AEC-Q100 Automotive grade certification and support stable operation at a wide temperature range of -40℃ to 125℃ . The products combine high integration and high performance advantages, with single-chip integration of pre-driver, communication interface, and core control algorithms , which can greatly simplify customer hardware design. At the same time, they are equipped with self-developed core algorithms such as sensorless FOC and NVH suppression, effectively improving the energy efficiency and driving experience of the thermal management system. Relying on a unified software and hardware ecosystem platform, the chip-in-solution can achieve rapid porting and iteration, helping customers significantly shorten development cycles and reduce overall costs.

Full-chain solution with live demonstrations, addressing industry pain points

Jinxin Technology not only showcased its core chip products, but also demonstrated a full-chain thermal management solution covering chips, algorithms, hardware and software. Through live running demonstrations and real-time oscilloscope waveform displays, the excellent performance of Jinxin's solutions in control accuracy, operational stability, low noise, and low-temperature startup was visually presented. With mature mass-production verification and significant cost-reduction advantages, Jinxin precisely addressed the industry's core pain points such as cost control, supply security, and performance improvement, earning high recognition.

Expert keynote speech, sharing cutting-edge technology insights

During the exhibition, Li Ying, Sales Director of Jinxin Technology's Automotive Market, delivered a keynote speech titled "Chip Solutions for Extreme Environments and Platform-Based Applications in Automotive Thermal Management", sharing insights on industry trends and Jinxin's technical practices. The presentation fully demonstrated the company's deep technical accumulation and forward-looking vision in the field of automotive thermal management chips, winning widespread attention and praise.

Booth drew huge crowds, precise connection with industry resources

Thanks to the rich technical displays and professional explanations, Jinxin Technology's booth attracted a large number of professional visitors. R&D, procurement, and technical leaders from OEMs, Tier1 suppliers, research institutions, and industry partners engaged in in-depth exchanges with the Jinxin team on chip technology, application scenarios, customization needs, and industry trends, laying a solid foundation for future cooperation.

This exhibition fully demonstrated Jinxin Technology's leading strength in domestic chips for automotive thermal management, and further deepened connections and exchanges along the industry chain. In the future, Jinxin Technology will continue to focus on automotive-grade chip design, increase R&D investment in core technologies, and focus on performance enhancement and reliability optimization, launching products and solutions that better meet the development needs of the new energy vehicle industry.Relying on its 100% domestic supply chain advantages and tens of millions of mass-production verification experience, Jinxin Technology will continue to provide the industry with safe, reliable, and cost-effective chip-level solutions. Together with industry partners, it will support the high-quality development of China's new energy vehicle industry.