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Jinxin Technology made its debut at the 2026 Shanghai International New Energy Vehicle Thermal Management Technology Exhibition and successfully concluded!
6 From March 3rd to 5th, the 2026 ATC Shanghai International New Energy Vehicle Thermal Management Technology Exhibition was grandly held at the Shanghai New International Expo Center. As a benchmark exhibition in the field of thermal management for new energy vehicles in Asia, this exhibition brings together top enterprises and professional visitors from the entire industry chain, creating a top-level platform for technical exchange and business docking.
Jinxin Technology, as a leading domestic automotive grade DSP/SoC chip design enterprise , has been deeply involved in the field of automotive thermal management chips for many years. With millions of experience in mass production certification and complete domestic supply chain advantages, showcased multiple series of automotive grade chips and thermal management solutions at the exhibition. It comprehensively demonstrated the technological strength and mass production achievements of domestic chips in the field of automotive thermal management, attracting many industry colleagues to stop and exchange ideas.
The hardcore chip matrix covers the entire field of thermal management requirements
. At this exhibition, Jinxin Technology showcased multiple series of train grade chips, covering the full voltage level of 12V/24V/48V and adapting to the full level of thermal management control requirements. The application scenarios run through core links such as electronic water pumps/oil pumps, electronic fans, air conditioning compressors, blowers, and thermal management domain controllers .
All participating chips have passed AEC-Q100 Vehicle level certification , supports -40 Stable operation at a wide temperature range of ℃~125 ℃ . The product combines high integration and high performance advantages, with single-chip integrated pre drive, communication interface, and core control algorithm , which can greatly simplify customer hardware design; At the same time, it is equipped with self-developed core algorithms such as sensorless FOC and NVH suppression, which can effectively improve the energy efficiency and driving experience of the thermal management system. Relying on a unified software and hardware ecosystem platform, the chip in solution can achieve rapid porting and iteration, helping customers significantly shorten development cycles and reduce overall costs.
Real machine demonstration of full chain solution, targeting industry pain points
Jinxin Technology not only showcased core chip products, but also demonstrated full chain thermal management solutions from chips to algorithms, from hardware to software. On site through Real machine operation demonstration and oscilloscope waveform real-time display , visually presenting the excellent performance of the chip insertion scheme in control accuracy, operation stability, low noise, and low-temperature start-up aspects. With mature mass production verification and significant cost reduction advantages, Jinxin has accurately solved the core pain points faced by the industry, such as cost control, supply security, and performance improvement, and has gained high recognition.
Expert keynote speech, sharing cutting-edge technology insights
During the exhibition, Li Ying, Sales Director of Jinxin Technology's Automotive Market, delivered a keynote speech titled "Chip Solutions for Extreme Environments and Platform based Application of Automotive Thermal Management" , sharing industry development trends and Jinxin technology practices, fully demonstrating the company's profound technical accumulation and forward-looking insights in the field of automotive thermal management chips, winning widespread attention and recognition. Good review.
The on-site popularity was overwhelming, and the precise integration of industry resources
attracted a large number of professional visitors with rich technical exhibitions and professional explanations. R&D, procurement, and technical leaders from host manufacturers, Tier 1 suppliers, research institutions, and industry partners had in-depth exchanges with the chip technology, application scenarios, customized requirements, and industry trends with the chip team, laying a solid foundation for future cooperation.
