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Jinxin Electronics made its debut at the 6th Liyang Thermal Management Forum
October 30 to October 31, the 6th Liyang Thermal Management Forum was successfully held in Liyang, Jiangsu. More than a thousand industry experts and enterprise representatives from the fields of new energy vehicles, data centers, AI chips, and low altitude economy gathered together to conduct in-depth discussions on the cutting-edge trends of thermal management technology and industry synergy. Hunan Jinxin Electronic Technology Co., Ltd. showcased multiple DSP/SoC chips and system solutions at the exhibition, demonstrating the core supporting role of chips in the process of intelligent thermal management.
Core chip solution showcases hard power
As a leading DSP/SoC chip design enterprise in China, Jinxin Electronics focuses on the control requirements of thermal management systems and highlights ADM32F036 Series, AVP32F0049 series and other automotive grade chips . The displayed ADM32F036 The chip has a dual core architecture and programmable control acceleration unit. supports high-precision control of key components such as electronic water pumps/oil pumps, air conditioning compressors, electronic fans, and robot joint motor drives in 12V/24V/48V systems. It is widely used in new energy vehicles, data center liquid cooling, and robots, helping to achieve more efficient and low-carbon thermal management operations.
The theme sharing sparked live attention
The forum set up new energy resources vehicles low temperature heat pump, data center liquid cooling, high power chip cooling and other topics. Xu Zhongling, Director of Feed Electronics Application Solutions, delivered a keynote speech on "Application Sharing of Feed Core High-Performance DSP and SoC Chips in Automotive and Industrial Applications" at the new energy resources automotive low-temperature heat pump summit. The system explained the technical path of the chip in system energy efficiency optimization and control intelligence, which triggered extensive discussion among participants.
Booth interaction promotes cooperation opportunities
At the exhibition site, the popularity of Jinxin Electronics booth was high, attracting guests from vehicle manufacturers, Tier 1 suppliers, data center enterprises and other fields to stop and exchange ideas. In depth communication was conducted on chip demand, system integration and technological innovation under the trend of intelligent thermal management, laying a good foundation for future cooperation.
With the continuous evolution of the thermal management industry towards intelligence, integration, and greenness, the role of chips as core control units is becoming increasingly prominent. Jinxin Electronics will continue to promote the iteration of DSP/SoC chip technology and adapt to thermal management scenarios, using high-performance and high reliability chip solutions to help customers achieve system energy efficiency improvement and reliability upgrades, and work together with industry partners to build a new ecosystem for thermal management.
